NMIS require C-SAM (scanning acoustic microscope) capability. C-SAM is required to non-destructively inspect work-pieces at various stages of our semiconductor packaging process. We require a machine that can accept samples approximately 500 x 500 mm and is suitable for use in a semiconductor manufacturing context to detect delamination and other structural discontinuities in semiconductor packages. Machine outputs should include high resolution C-Scan images, and possibly A- and B- scan images.